Copper etching solution and method
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United States of America Patent
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-
Aug 28, 1990
Grant Date -
N/A
app pub date -
Dec 15, 1989
filing date -
Dec 15, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process and solution for selectively etching copper. The etching is effected by a nonaqueous solution of dimethyl sulfoxide and a halocarbon compound.
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Cited Art Landscape
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