Vapor deposition patterning method
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United States of America Patent
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-
Aug 28, 1990
Grant Date -
N/A
app pub date -
Oct 12, 1988
filing date -
Oct 12, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An etchless patterning method for depositing material patterns upon substrates. The method involves providing substrate to be patterned, immobilizing a patterned physical mask upon a mask carrier, transferring the mask from the carrier to contact the substrate, immobilizing the mask upon the substrate while removing the mask carrier, exposing the masked substrate to vapor phase pattern material in a vacuum, reimmobilizing the mask upon the mask carrier and removing the mask from the substrate in a manner that allows the mask to remain immobilized on the mask carrier. The process is particularly well suited for the production of circuit boards or electronic applications.
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