Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
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United States of America Patent
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Sep 4, 1990
Grant Date -
N/A
app pub date -
Mar 7, 1989
filing date -
Mar 7, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a method of chem-mech polishing an electronic component substrate. The method includes the following steps; obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant; and contacting the substrate with a polishing pad while contacting the substrate with a slurry containing the etchant wherein the slurry includes abrasive particles, a transition metal chelated salt and a solvent for the salt. The chem-mech polishing causes the at least two features to be substantially coplanar. Also disclosed is the chem-mech polishing slurry.
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