Method of applying adherent coating on copper
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United States of America Patent
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-
Sep 4, 1990
Issued Date -
N/A
app pub date -
Jul 7, 1988
filing date -
Jan 14, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of applying a coating to the inner layers of multilayer boards made of copper. The cured coating is capable of maintaining adhesion without outgassing for at least 10 seconds at 250.degree. C. It can be adhesion promoted for adherent electroless metal deposition with a chromic acid adhesion promotion solution. The coating composition comprises the product of reacting between 20 to 60% of a poly(vinyl acetal) resin with 80 to 40% of a phenolic resin in the presence of an acidic catalyst and a coupling agent having at least two amino substituted aromatic groups covalently bonded to a titanium or zirconium central atom via an oxygen containing linkage. The coating composition is applied to a metallic oxide film on the surface of the copper substrate.
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