Interconnection of electronic components
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United States of America Patent
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-
Sep 11, 1990
Issued Date -
N/A
app pub date -
Feb 1, 1988
filing date -
Dec 17, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length.
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