Integrated circuit chip stacking
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United States of America Patent
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-
Sep 11, 1990
Grant Date -
N/A
app pub date -
Nov 4, 1988
filing date -
Nov 4, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device for increasing the density of integrated circuit chips on a printed circuit board. A plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board. Each of the input/output data terminals, power and ground terminals of the chips are connected in parallel. Each chip is individually accessed by selectively enabling the desired chip.
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