Thermoplastic molding materials

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United States of America Patent

PATENT NO 4957965
SERIAL NO

07228720

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Abstract

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Thermoplastic molding materials contain, as essential components, (A) 5-95% by weight of a polyamide; (B) 5-95% by weight of a modified polyphenylene ether, prepared from (b.sub.1) 4.95-99.9% by weight of a polyphenylene ether, (b.sub.2) 0-90% by weight of a vinylaromatic polymer, (b.sub.3) 0.05-10% by weight of one or more compounds from the group consisting of (b.sub.31) an .alpha.,.beta.-unsaturated dicarbonyl compound, (b.sub.32) a monomer containing amide groups and a polymerizable double bond and (b.sub.33) a monomer containing lactam groups and a polymerizable double bond, (b.sub.4) 0-80% by weight of further graft-active monomers and (b.sub.5) 0.01-0.09% by weight of a free radical initiator, (C) 0-90% by weight of an unmodified polyphenylene ether, (D) 0-45% by weight of a vinylaromatic polymer and (E) 0-40% by weight of a rubber impact modifier.

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Patent Owner(s)

Patent OwnerAddress
BASF AKTIENGESELLSCHAFT67063 LUDWIGSHAFEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boehlke, Klaus Hessheim, DE 18 231
Brandt, Hermann Schifferstadt, DE 5 87
Muehlbach, Klaus Heppenheim, DE 48 322
Taubitz, Christof Wachenheim, DE 21 262

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