Thermoplastic resin composition

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United States of America Patent

PATENT NO 4957966
SERIAL NO

07203187

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Abstract

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A novel thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D), said composition (D) comprising a polyphenylene ether (A), a rubber-like materail (B) and a mutual compatibilizer (C), said polyphenylene ether (A) being obtained from at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity .eta..sub.sp/c of 0.40-0.58 deciliter/gram, said mutual compatibilizer (C) being compatible or reactive with said polyphenylene ether and reactive with said polyamide resin, and said polyamide resin (E) having a number average molecular weight of 14,000-40,000 and an end amino group content of 50-95 mmole/kg, wherein the thermoplastic resin composition constitutes 1-65 wt. % of said polyphenylene ether (A), 1-20 wt. % of said rubber-like material (B), 0.01-5 wt. % of said mutual compatibilizer (C) and 35-97.99 wt. % of said polyamide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 micron or less.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO CHEMICAL COMPANY LIMITED 15 KITAHAMA 5-CHOME HIGASHI-KU OSAKA JAPAN A CORP OF JAPANNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Hiroomi Chiba, JP 34 562
Hosoda, Satoru Chiba, JP 13 311
Nishio, Taichi Chiba, JP 31 700
Okada, Takayuki Ehime, JP 80 951
Sanada, Takashi Chiba, JP 94 1106
Suzuki, Yasurou Chiba, JP 12 244

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