Importance

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Abstract

A preferred embodiment comprises, on one face, an encapsulated hybrid circuit that groups together circuits with high density of integration, formed by one or more semiconductor chips, said circuits being mounted on a thin-layer substrate. The thin-layer substrate is grown on one face of a supporting, thick-layer substrate, preferably made of co-baked ceramic. Encapsulate, microelectronic components such as monolithic, integrated circuits are borne on the other face of the substrate. The interconnections among various components and with the exterior are made within and through the layers of the supporting substrate so that no wire or connection appears on the uncovered parts of the substrate. A detachable, elastomer connection scheme enables the connection of the input/output interconnection terminals of the module with the exterior.

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First Claim