Manufacture of printed circuit board assemblies
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United States of America Patent
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Oct 2, 1990
Grant Date -
N/A
app pub date -
Aug 14, 1989
filing date -
Dec 3, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
To avoid the use of harmful CFCs in the cleaning of soldered printed circuit board assemblies, their manufacture is accomplished using a screen-printable solder paste composition which will in use yield minimal flux residues which will not require removal by a solvent cleaning step. The paste composition is formulated by incorporating the powdered soft solder alloy in a liquid medium containing up to 10% by weight of a non-corrosive organic flux material, a substantially water-immiscible organic solvent, and one or more thickening agents.
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