Arrangement of a semiconductor device for use in a card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 2, 1990
Issued Date -
N/A
app pub date -
Jan 23, 1989
filing date -
Feb 6, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein a metal layer is formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed. The semiconductor pellet is secured to the circuit board by bonding the metal layer to the circuit board and is sealed with a high polymer material on the circuit board.
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Family
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