VLSI optimized modulator
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United States of America Patent
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Oct 9, 1990
Grant Date -
N/A
app pub date -
Feb 22, 1988
filing date -
Feb 22, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention relates to an electro-optic modulator device, such as a multi-gate light valve for an electro-optic line printer, wherein the different elements are uniquely combined in a package utilizing VLSI principles. A specially designed integrated circuit package is utilized to enable the bonding of one or two electro-optical devices as a single unit. As each electro-optical device has its chip pads at one end of the device, special modifications need to be made to joint the pads to the external connectors. The electro-optical crystal, which may be mounted on a glass plate, is bonded to the integrated circuit chip. Sonic bonding or the two layer metal technique may be used for the crystal to chip bonding.
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