Printed wiring board substrate for surface mounted components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 16, 1990
Grant Date -
N/A
app pub date -
Mar 5, 1985
filing date -
Mar 5, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A laminated printed wiring board having surfaces thereof fabricated from conventional fiber reinforced laminates which are secured together by means of an adhesive fabricated of a reinforced thermosetting resin having a coefficient of thermal expansion (CTE) which is substantially smaller than the CTE of the surface laminate whereby the apparent CTE of the overall printed wiring board assembly is substantially controlled.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully