V-shaped clip for attaching a semiconductor device to a heat sink
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United States of America Patent
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Oct 23, 1990
Grant Date -
N/A
app pub date -
Sep 21, 1988
filing date -
Sep 21, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resilient spring clip for attaching a semiconductor to a heat sink comprising a first surface and an attachment means, the attachment means comprising a pair of V-shaped legs adapted to fit into and be secured to a slot in a heat sink so that the first surface spring-engages the semiconductor and holds it to the heat sink, the clip taking up little extra space.
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