Low temperature impact and puncture resistant thermoplastic films and bags therefrom
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United States of America Patent
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Oct 23, 1990
Issued Date -
N/A
app pub date -
Mar 9, 1987
filing date -
Sep 11, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Thermoplastic films and bag structures having improved low temperature impact and puncture resistance properties and high resistance to heat comprise a film layer comprising a blend of polypropylene copolymer and a material selected from polyisobutylene, very low density polyethylene, polybutylene, and ethylene-methyl acrylate copolymer, and mixtures thereof. The films and bag structures preferably have an outer film layer of a resin material having a melt temperature which is higher than that of the other film layer. The outer film layer material is preferably a polyester or a polyamide. The films and bag structures are particularly suitable for use as frozen food storage containers and for subsequent heating and/or cooking of food therein.
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