Apparatus for probing a microwave circuit
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United States of America Patent
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Oct 23, 1990
Grant Date -
N/A
app pub date -
Jun 5, 1989
filing date -
Jun 5, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Apparatus suitable for on-wafer probing of microwave integrated circuits includes a coplanar waveguide carried on one surface of an elongate, tapered, dielectric substrate. The waveguide includes a signal conductor extending substantially the length of the substrate and a pair of ground conductors extending along the opposite edges of the signal conductor. The substrate is bonded to a metal mounting block adjacent one end of an coaxial electrical connector. Conductive bonding material, suitably a conductive epoxy material, is applied along the outer edges of the ground conductors to establish a low impedance ground path between the coaxial waveguide and the metal block.
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