Apparatus for low stress polishing of spherical objects

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United States of America Patent

PATENT NO 4965967
SERIAL NO

07455182

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Abstract

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Apparatus for polishing spherical objects includes first and second plates having smooth facing surfaces. A first plate comprises ceramic material which is rotatably supported, and the first plate includes a transparent plate. Spherical objects to be polished are placed between the two plates along with an abrasive slurry, and magnets are positioned on a top surface of the first plate to magnetically limit the path of travel of the spherical objects as the second plate is rotated. The first plate includes at least one radially concave groove in which this spherical objects are mixed during a polishing operation.

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Patent Owner(s)

Patent OwnerAddress
ENDWAVE CORPORATION321 SOQUEL WAY SUNNYVALE CA 94086-4102 UNITED STATES OF AMERICA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
London, Christopher L San Jose, CA 3 24

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