Surface treatment method and apparatus therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 30, 1990
Issued Date -
N/A
app pub date -
Aug 25, 1989
filing date -
Oct 1, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Time periods required for dipping semiconductor wafers in a treatment liquid in a treatment bath and for replacing the treatment liquid etc. are previously stored in a memory. Based on these data, the expected clock time when the semiconductor wafers reach each treatment bath is calculated and the replacement of the treatment liquid and transportation of the wafers are controlled on the basis of these data and the expected clock time.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully