Importance

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Abstract

A tape carrier for mounting and bonding an IC chip on substrate having an interconnection pattern is disclosed. The tape carrier comprises a peripheral and a central film portion made of an electrically insulating flexible material, and a set of leads carried at least one the peripheral film portion. The central portion covers the central area of the surface of the IC chip on which the bumps are formed. An aperture is formed between the peripheral and central film portion which has enough dimension to allow the leads to be bonded to the bumps of the IC chip therethrough. Some of the leads extend over the central film portion and, extending out of a side of the central film portion, reach the opposing area of the peripheral film portion across a strip of the aperture, thereby effecting electrical connection from the bumps to far-away portions of the circuitry on the substrate and between the bumps themselves. The central film portion may form an island separated from the peripheral potion by a ring-shaped aperture; alternatively, it may form a tongue-shaped appendage projecting into the aperture. The leads and the IC chip may be situated on the same surface of the film portions; alternatively, they may be situated on the opposite surfaces thereof.

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First Claim