Electronic circuit and method of production thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 30, 1990
Grant Date -
N/A
app pub date -
Jul 7, 1989
filing date -
Jul 15, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic circuit with flip-chip mounting of a semiconductor chip (5) on a substrate (1), wherein there is provided between the semiconductor chip (5) and the conductor tracks (2) of the substrate (1) a metallic solder stop layer (3) which is insulated from its environment by an oxide layer (4). With this type of solder stop layer, it is possible to obtain layer thickness which can be exactly reproduced, as a result of which a reliable flip-chip soldering is achieved.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully