Metallized ceramic circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 30, 1990
Grant Date -
N/A
app pub date -
Jan 2, 1990
filing date -
Jan 2, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The individual components of a shielded ceramic, RF mounting package are metallized on three of their outer surfaces. The package includes circuit supporting ceramic substrate metallized along its edges as well as on the horizontal surfaces to permit continuous metal contact between the substrate and a metallized ceramic seal ring and the metal lid and base of the package.
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Cited Art Landscape
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