Semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 13, 1990
Issued Date -
N/A
app pub date -
Apr 9, 1990
filing date -
Jan 7, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate and semiconductor chips are connected by solder bumps and a vacant space around the solder bumps is coated with resin in such a degree that the tops of the semiconductor chips are not coated therewith. Epoxy resin or a resin having a smaller thermal expansion coefficient than the epoxy resin is used in the resin coating, and an inorganic material having a smaller thermal expansion coefficient than said resin is mixed therein.
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