Power semiconductor module and method for producing the module
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United States of America Patent
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-
Nov 13, 1990
Grant Date -
N/A
app pub date -
May 19, 1988
filing date -
May 23, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A power semiconductor module and method for producing the module includes a plastic housing having a lower surface. An electrically insulating substrate having an upper surface is inserted in the lower surface of the plastic housing for supporting electrical components. A metallization is disposed at least on the upper surface of the substrate. The metallization on the upper surface of the substrate is patterned to form conductor tracks. Components are soldered onto the patterned metallization. Locating compartments disposed in the plastic housing form a soldering jig for the components during production of the module.
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