Multi-lead hermetic power package with high packing density
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United States of America Patent
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-
Nov 20, 1990
Grant Date -
N/A
app pub date -
Jan 30, 1989
filing date -
Jan 30, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs protruding from opposite corners thereof. The mounting tabs are configured to allow the packages to be nested together. A cover attached to the walls provides a hermetically sealed package.
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Cited Art Landscape
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