Importance

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Abstract

A semiconductor component including a doped semiconductor substrate into which an oppositely doped upper doping region is introduced from an upper surface to form a P-N junction which emerges at the upper surface in an edge region of the substrate. To impove the reverse breakdown voltage capacity below the surface inner section of the P-N juction, an oppositely doped lower doping region is buried in the semiconductor substrate beneath where the P-N juction emerges at the upper surface. The oppositely doped, lower doping region reduces the charge carrier concentration in the critical area. The structure retains the planar surface and is easily producible.

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First Claim