Multiaxially oriented thermotropic polymer substrate for printed wire board
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United States of America Patent
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Dec 4, 1990
Grant Date -
N/A
app pub date -
Jun 20, 1988
filing date -
Jun 20, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to the use of multiaxially oriented (e.g., biaxially) thermotropic polymers as a substrate material for the preparation of printed wire boards (PWB). In preferred embodiments, the PWB of the present invention comprises a generic, high density, organic multilayer PWB comprising XYDAR.RTM. and/or VECTRA.RTM. films, capable of being employed as a high density leadless perimeter and in grid array ceramic chip packages.
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