Polyimide substrate having a textured surface and metallizing such a substrate
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United States of America Patent
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-
Dec 4, 1990
Grant Date -
N/A
app pub date -
Jul 11, 1989
filing date -
Jul 11, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The adhesion of metal to a polyimide substrate is enhanced by depositing onto at least one surface of the polyimide a thin film of metal such as copper and heating in air to cause the deposited metal to texturize that surface by producing asperities that are at least 0.05 .mu.m in average height and average breadth. In doing so, metal oxide clusters are formed at the textured surface. When the textured surface is metallized, the resulting composite resists delamination even at soldering temperatures.
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