Composite polymer/desiccant coatings for IC encapsulation
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United States of America Patent
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Dec 11, 1990
Issued Date -
N/A
app pub date -
Mar 6, 1990
filing date -
Dec 16, 1987
priority date (Note) -
Expired
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Abstract
This invention is directed to composite coating for maintaining low moisture levels at the surface of solid substrates. One embodiment of the invention comprises a coating having a desiccant layer between layers of the same or different elastomeric polymers. Another embodiment comprises a layer of elastomeric polymer covered with a layer of an elastomeric polymer/desiccant mixture. The composite coating may be applied to integrated circuits to prevent corrosion thereof.
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