Molded resin casing of electronic part incorporating flexible board
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United States of America Patent
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-
Dec 18, 1990
Issued Date -
N/A
app pub date -
Sep 13, 1988
filing date -
Aug 21, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.
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