Laminated board for testing electronic components
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United States of America Patent
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-
Dec 18, 1990
Issued Date -
N/A
app pub date -
Apr 24, 1990
filing date -
Mar 15, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic component testing laminated board suitable for performing a heat test on electronic components of a multikind and small quantity production type. The laminated board includes a metal plate, a testing circuit layer including a double-sided printing wiring board or the like and integrally formed through a thin electric insulating layer on one side of the metal plate for mounting thereon electronic components to be tested, and a heater circuit layer including a metal foil circuit or the like and integrally formed through another electric insulating layer on the other side of the metal plate for maintaining the testing circuit layer at a given temperature. An inorganic filler or the like is added to the electric insulating layers. An electronic component testing box for removably accommodating the electronic component testing lamianted board includes walls made of a heat insulating material, power supply connecting connector, signal input and output connector, temperature measuring apparatus, etc.
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