Printed circuit board heat sink
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United States of America Patent
Stats
-
Dec 18, 1990
Grant Date -
N/A
app pub date -
Jun 12, 1989
filing date -
Jun 12, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat sink for a printed circuit board in comprised of a thermally-conductive plate having on one surface a thermally-conductive, electrically-insulative elastomer layer which conformally engages at leasts a portion of the back surface of the printed circuit board. The ends of pins of electronic components mounted on the board and desired to be cooled embed into the elastomer layer to provide a conductive path for transfer of heat from the electronic components to the elastomer layer and then to the thermally-conductive plate.
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