Apparatus for treating wafers in the manufacture of semiconductor elements
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United States of America Patent
Stats
-
Dec 25, 1990
Grant Date -
N/A
app pub date -
Jun 13, 1988
filing date -
Jun 15, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for the treatment of wafers in the manufacture of semiconductor elements in the form of a process buffer through which a plurality of wafers travel at the same time to various treatment stations and which cooperates with a transport apparatus for the wafers. The apparatus has a shaft magazine, in which the treatment stations, each for one wafer, are disposed spaced apart from and above one another. The shaft magazine is provided with a loading and unloading opening, and the treatment stations are movable individually into the vicinity of the loading and unloading opening. The apparatus occupies less surface area in the process line for the manufacture of semiconductor elements, enables treatment of the wafers independent of external factors, and can be used for various types of treatment of the wafers in the manufacture of semiconductor elements.
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