An apparatus for reflow smoothing a molded article made by first heating a face of a mold at a first station, then applying a fusible synthetic resin to the heated face and thereby melting the resin into a continuous coating covering the heated mold face at a second station spaced angularly from the first station, and cooling the coating and mold at the second station until the coating hardens. To reflow smooth the article, the surface of the cooled coating is then smoothed by confining the mold and hardened coating in a substantially closed chamber at the second station and reheating the confined coating until its surface flows. Thereafter the coating is cooled again at a third station angularly spaced from and downstream of the second station until it hardens and the hardened covering is stripped from the mold at a fourth station angularly spaced downstream of the third station and upstream of the first station.
Please note there is up to 60 days of latency in this Status indicator for certain status conditions. You can obtain up-to-date Status indicator readings by ordering PAIR for the file.
An application with the status "Published" (which means it is pending) may be recently abandoned, but not yet updated to reflect its abandoned status. However, an application filed less than one year ago is unlikely to be abandoned.
A patent with the status "Granted" may be recently expired, but not yet updated to reflect its expired status. However, it is highly unlikely a patent less than 3.5 years old would be expired.
An application with the status "Abandoned" is almost always current, but there is a small chance it was recently revived and the status not yet updated.
This priority date is an estimated earliest
priority date and is purely an estimation. This date should not be
taken as legal conclusion. No representations are made as to the
accuracy of the date listed. Please consult a legal professional
before relying on this date.