Thermosetting resin composition from alkenyl aryloxy triazine compound and poly maleimide

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United States of America Patent

PATENT NO 4980436
SERIAL NO

07464145

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Abstract

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A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said triazine compound, and an inorganic filler as essential components; and said s-triazine compound.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO CHEMICAL COMPANY LIMITED2-7-1 NIHONBASHI CHUO-KU TOKYO 103-6020

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamio, Kunimasa Suita, JP 29 296
Kanagawa, Shuichi Niihama, JP 48 973
Saito, Yasuhisa Higashiosaka, JP 27 255
Shiomi, Yutaka Hirakata, JP 33 210

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