Integrated circuit package carrier
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 25, 1990
Grant Date -
N/A
app pub date -
Dec 26, 1984
filing date -
Dec 26, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A carrier for an integrated circuit package is disclosed which comprises a base (30) suitable for receiving an integrated circuit package with unformed leads (20') or formed leads (20), a cover (60), flexible material (66), such as an elastomer, disposed between the cover (60) and base (30) surfaces, and pressure is maintained across the cover (60) and base (30) by way of finger (44) on a clip (40) on the base (30) engaging latching edges (68) of cover (60). The leads (22) of the integrated circuit package (20, 20') are thereby secured in position by the elastomeric material (66) which forms itself partially around each of the leads in response to pressure applied across the base (30) and cover (60) as hereinabove described. The disclosed invention eliminates the need for separate grooves or nests in the base (30) of the carrier for each lead of the integrated circuit package.
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