Transition metal clad interconnect for integrated circuits
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United States of America Patent
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-
Dec 25, 1990
Grant Date -
N/A
app pub date -
Dec 29, 1986
filing date -
Dec 29, 1986
priority date (Note) -
Expired
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Abstract
An integrated circuit includes a patterned aluminum based interconnect clad on the top and side portions with a layer of transition metal. The cladding of transition metal prevents the formation of both vertical hillocks and lateral protrusions. Preventing these formations increases the reliability of an interconnect by significantly reducing passivation cracking and electrical shorting between interconnects which result from vertical hillock and lateral protrusion formations.
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