Process and composition for sensitizing articles for metallization
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United States of America Patent
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Jan 1, 1991
Issued Date -
N/A
app pub date -
Feb 21, 1978
filing date -
Jul 11, 1972
priority date (Note) -
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Abstract
Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the elemnt(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.
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