Method and apparatus for cooling an integrated circuit chip during testing
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United States of America Patent
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Jan 1, 1991
Grant Date -
N/A
app pub date -
Feb 6, 1989
filing date -
Feb 6, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for testing integrated circuit devices includes a cooling chuck which is extensible within a bore in a cooling chuck body to a position in thermal contact with the integrated circuit device. The temperature of the cooling chuck is regulated by a fluid cooling system, which can be set to operate at a selected capacity to maintain the integrated circuit device at a desired temperature during testing.
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