High density integrated circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 1, 1991
Issued Date -
N/A
app pub date -
Aug 8, 1989
filing date -
Feb 27, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The specification discloses a package for a large number of integrated circuits. The package includes a top piece and a bottom piece formed of crystalline silicon with two levels of conductor regions formed in the top and bottom pieces. The integrated circuits are placed vertically between the top and bottom pieces and are held to the top and bottom pieces by high temperature adhesives. Solder balls which are placed on integrated circuits after the fabrication of the integrated circuits are then heated to cause the solder balls to reflow onto their respective connectors in the top and bottom pieces. TAB type conductors are then connected to the top and bottom pieces so that the integrated circuit held within this embodiment of the present invention may be connected to other circuitry.
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