Hot stamping decal resist
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United States of America Patent
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Jan 8, 1991
Grant Date -
N/A
app pub date -
Aug 3, 1989
filing date -
Aug 3, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This present invention is directed to a new technique for supplying and applying resist to copper and other substrate material. In accordance with the present invention, a hot stamping resist decal comprises a release sheet bearing a pattern of the dried residue of a resist. The resist comprises an ester of a styrene/maleic anhydride copolymer, a particulate filler, and a solvent. Advantageously, a plasticizer is included in the resist formulation and the particulate filler preferably includes a clay. The method of manufacturing the inventive hot stamping resist decal and for hot stamping the decal on a circuit board form additional aspects of the present invention.
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