Semiconductor device and a method for fabricating the same
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United States of America Patent
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Jan 8, 1991
Grant Date -
N/A
app pub date -
Oct 7, 1983
filing date -
Oct 8, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
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