Semiconductor device wirings with hillocks
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United States of America Patent
Stats
-
Jan 8, 1991
Grant Date -
N/A
app pub date -
Jul 21, 1989
filing date -
Sep 24, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device comprises metal wirings with its minimum line width of 1 .mu.m or less and on the surface of said metal wiring there is no hillock which has its height equal to or more than 1/4 of the minimum line width of said metal wiring. The main portion of said metal wiring is formed with pure metal, and is supplied in connection portion between the metal wiring and a semiconductor substrate with a barrier layer for preventing any atoms involved in said metal parts from diffusing into the semiconductor substrate.
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