Moisture-curable hot-melt adhesive composition
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United States of America Patent
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Jan 15, 1991
Grant Date -
N/A
app pub date -
Nov 14, 1989
filing date -
Nov 18, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A moisture-curable hot-melt adhesive composition comprising a reaction product obtainable by reacting (A) a mixture of (a) a high molecular weight thermoplastic polyester component predominantly composed of a hydroxy-terminated high molecular weight polyester containing a hydrocarbon chain with a molecular weight of 600 to 6,000 and having a molecular weight of 8,000 to 25,000 and (b) a low molecular weight polyol having a molecular weight of not more than 5,000 with (B) a polyisocyanate compound in an NCO/OH ratio of 1.4 through 3. This moisture-curable hot-melt adhesive composition is useful for the adhesion at a low temperature, and shows an excellent heat resistance and initial physical properties.
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