Pressure sensitive adhesive composition

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United States of America Patent

PATENT NO 4987186
SERIAL NO

07287308

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Abstract

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This invention provides a pressure sensitive adhesive composition comprising an acrylic copolymer component (A) which is at least in part an acetoacetyl group-containing acrylic copolymer and at least one curing component (B) selected from the class consisting of isocyanate compounds, epoxy compounds, aldehyde compounds, non-amino resin amine compounds, metal salts, metal alkoxides, metal chelate compounds, ammonium salts and hydrazine compounds. This adhesive composition is well-balanced in the triad of tack, adhesion, cohesion in adhesion technology and can be advantageously used in various applications such as adhesive tapes and labels.

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Patent Owner(s)

  • NIPPON GOHSEI KAGAKU KOGYO KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Mamoru Ibaraki, JP 18 198
Matsuyama, Takeshi Takatsuki, JP 8 81
Yamashita, Akira Ohmihachiman, JP 164 1327
Yanagida, Yoshiyuki Ibaraki, JP 1 46

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