Semiconductor package having leads that break-away from supports
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United States of America Patent
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Jan 29, 1991
Grant Date -
N/A
app pub date -
Jan 29, 1990
filing date -
Jan 29, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package wherein a semiconductor die is disposed in packaging material and electrically coupled to leads having portions extending from the packaging material. The portions of the leads that extend from the packaging material are adhered to the outside of the packaging material and release therefrom when subjected to a predetermined amount thermal stress. The invention disclosed herein allows consistent alignment of flexible leads while adequately reducing stress caused by the differing coefficients of thermal expansion of the semiconductor package and a printed circuit or the like on which the package is mounted.
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