Circuit assembly and method with direct bonded terminal pin
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United States of America Patent
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-
Feb 5, 1991
Issued Date -
N/A
app pub date -
Feb 12, 1990
filing date -
Apr 12, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electric circuit assembly includes a copper pin (310) extending through aligned apertures (304, 314) in a directly bonded ceramic substrate (302) and copper lead frame (312), and directly bonded to the substrate (302). The pin (310) has an enlarged flange head (322) at one end, and is thermally deformed and enlarged at the other end (324) during the direct bonding. In another embodiment, one end (342) of a copper pin (340) extends out of an aperture (334) in a ceramic substrate (332) and slightly beyond the substrate surface (336). A lead frame (346) is directly bonded to the substrate surface (336) and droops around the protruding end (342) os the pin (340) and conforms thereto during the heating during the direct bonding. The lead frame (346) has a humped configuration over the aperture (334) in the substrate (332) and engages the protruding end (342) of the pin (340) and is deformed and raised thereby away from the substrate surface (336). In one form, the lead frame (346) is directly bonded to the substrate surface (336) around the entire perimeter of the protruding end (342) of the pin (340) and forms a hermetic seal with the substrate surface (336) peripherally surrounding the protruding pin end (342).
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