Chip card structure
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United States of America Patent
Stats
-
Feb 5, 1991
Grant Date -
N/A
app pub date -
Dec 16, 1988
filing date -
Dec 22, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a method for the fabrication of chip cards. These cards are flat and undergo a high degree of deformation under bending and twisting stresses, when the user does not take any special precautions in their use. A micromodule is housed in a cavity of the card, and this micromodule is fixed by the natural adhesion between the plastic material of the bottom of the cavity and the coating resin of the integrated circuit of the module. To prevent the micromodule from being torn off during a bending stress undergone by the card, there is provision for at least one overhang by which the upper surface of the card covers an edge of the micromodule to limit the movements of said micromodule.
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