Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies
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United States of America Patent
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-
Feb 12, 1991
Grant Date -
N/A
app pub date -
Sep 22, 1989
filing date -
Sep 22, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A hermetically sealed combination ceramic and metal package for electronic components of an electronic device implantable in a living body, at least some of the components being adversely affected by high temperatures. The package comprises a ceramic sleeve and a metal band having substantially the same coefficients of linear thermal expansion. An annular end face of the sleeve butts against and hermetically seals to an annular end of the metal band. A header plate carrying a substrate upon which the components are mounted and a plurality of electrical connectors closes the open end of the sleeve and is hermetically sealed to the metal band.
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