Ceramic-glass integrated circuit package with ground plane
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United States of America Patent
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-
Feb 12, 1991
Grant Date -
N/A
app pub date -
May 7, 1990
filing date -
May 7, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate and a layer of conductive material adjacent the ceramic base substrate to serve as a ground plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground plane but physically separated therefrom. Incorporation of a ground plane into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.
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