Directly bonded simm module
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United States of America Patent
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-
Feb 12, 1991
Grant Date -
N/A
app pub date -
Feb 15, 1989
filing date -
Feb 15, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed circuit board (electrical only) as we now know it in the conventional SIMM module.
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